Fan-out sensor package

ABSTRACT

A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority to Korean PatentApplication No. 10-2018-0007333 filed on Jan. 19, 2018, in the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a fan-out sensor package.

BACKGROUND

Due to the development of semiconductor technology in accordance with anexplosive increase in the use of various electronic devices, precise andcomplicated electronic devices have appeared. Particularly, an opticalfield has been widely applied to various sensor components using imagingtechnology according to the related art.

In addition, in order to implement thinning of an optical fingerprintsensor mounted in a portable device, a manufacturing method using anelectronic component embedded substrate has recently been used. However,a complicated process is required in order to externally expose anoptical member bonded to an upper portion of an image sensor, and thereis a risk that photosensitivity will be decreased due to damage of theoptical member caused by permeation of foreign materials.

Accordingly, there is a need to develop a structure capable ofsimplifying a manufacturing process, increasing a path of light incidentto the image sensor, and decreasing stress applied to the opticalmember.

SUMMARY

An aspect of the present disclosure may provide a fan-out sensor packagein which a sensing area may be increased by increasing a path of lightincident to an image sensor and reliability of an optical member may beimproved by decreasing stress applied to the optical member at the timeof thermal impact.

According to an aspect of the present disclosure, a fan-out sensorpackage may include: a substrate in which a through-hole is formed andportions of a wiring layer are exposed from an insulating layer; animage sensor having an active surface having a sensing region disposedbelow the through-hole of the substrate and connection pads disposed inthe vicinity of the sensing region; an optical member disposed on theactive surface of the image sensor; a dam member disposed in thevicinity of the sensing region; and an encapsulant encapsulating thesubstrate and the image sensor, wherein the wiring layer and theconnection pads are electrically connected to each other by connectionmembers.

Side surfaces of the optical member may be disposed to be spaced apartfrom inner walls of the through-hole.

Side surfaces of the optical member may be exposed to external air.

The fan-out sensor package may further include a passive elementdisposed in the vicinity of the image sensor and encapsulated in theencapsulant, portions thereof being externally exposed.

The fan-out sensor package may further include an electrical connectionstructure encapsulated in the encapsulant, portions thereof beingexternally exposed.

The substrate may include a first substrate in which a firstthrough-hole is formed and a second substrate in which a secondthrough-hole is formed, the image sensor being disposed in the secondthrough-hole.

The first substrate and the second substrate may be electricallyconnected to each other by a connection member formed of a conductivematerial, and a sealing member may be disposed between the first andsecond substrates.

Connection pads of the second substrate may be disposed to be exposedexternally from the encapsulant.

The fan-out sensor package may further include an electrical connectionstructure disposed in the vicinity of the image sensor and protrudingfrom the encapsulant.

The fan-out sensor package may further include a metal bar disposed inthe vicinity of the image sensor and disposed so that one end thereof isexposed from the encapsulant.

The encapsulant may encapsulate the image sensor, and a lower surface ofthe image sensor may be externally exposed.

A plurality of wiring layers may be formed in the substrate.

According to another aspect of the present disclosure, a fan-out sensorpackage may include: a substrate in which a through-hole is formed andportions of a wiring layer are exposed from an insulating layer; animage sensor having an active surface having a sensing region disposedbelow the through-hole of the substrate and connection pads disposed inthe vicinity of the sensing region; an optical member disposed on theactive surface of the image sensor; and an encapsulant encapsulating thesubstrate and the image sensor, wherein the wiring layer and theconnection pads are electrically connected to each other by connectionmembers.

The encapsulant may be filled in spaces between side surfaces of theoptical member and inner walls of the through-hole.

The fan-out sensor package may further include a transparent materialfilled in spaces between side surfaces of the optical member and innerwalls of the through-hole.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic block diagram illustrating an example of anelectronic device system;

FIG. 2 is a schematic perspective view illustrating an example of anelectronic device;

FIGS. 3A and 3B are schematic cross-sectional views illustrating statesof a fan-in semiconductor package before and after being packaged;

FIG. 4 is schematic cross-sectional views illustrating a packagingprocess of a fan-in semiconductor package;

FIG. 5 is a schematic cross-sectional view illustrating a case in whicha fan-in semiconductor package is mounted on a ball grid array (BGA)substrate and is ultimately mounted on a mainboard of an electronicdevice;

FIG. 6 is a schematic cross-sectional view illustrating a case in whicha fan-in semiconductor package is embedded in a BGA substrate and isultimately mounted on a mainboard of an electronic device;

FIG. 7 is a schematic cross-sectional view illustrating a fan-outsemiconductor package;

FIG. 8 is a schematic cross-sectional view illustrating a case in whicha fan-out semiconductor package is mounted on a mainboard of anelectronic device;

FIG. 9 is a schematic cross-sectional view illustrating a fan-out sensorpackage according to a first exemplary embodiment in the presentdisclosure;

FIGS. 10 through 14 are views illustrating processes of a method ofmanufacturing a fan-out sensor package according to a first exemplaryembodiment in the present disclosure;

FIG. 15 is a schematic cross-sectional view illustrating a fan-outsensor package according to a second exemplary embodiment in the presentdisclosure;

FIG. 16 is a schematic cross-sectional view illustrating a fan-outsensor package according to a third exemplary embodiment in the presentdisclosure;

FIG. 17 is a schematic cross-sectional view illustrating a fan-outsensor package according to a fourth exemplary embodiment in the presentdisclosure;

FIG. 18 is a schematic cross-sectional view illustrating a fan-outsensor package according to a fifth exemplary embodiment in the presentdisclosure;

FIG. 19 is a schematic cross-sectional view illustrating a fan-outsensor package according to a sixth exemplary embodiment in the presentdisclosure;

FIG. 20 is a schematic cross-sectional view illustrating a fan-outsensor package according to a seventh exemplary embodiment in thepresent disclosure; and

FIG. 21 is a schematic cross-sectional view illustrating a fan-outsensor package according to an eighth exemplary embodiment in thepresent disclosure.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will now bedescribed in detail with reference to the accompanying drawings. In theaccompanying drawings, shapes, sizes, and the like, of components may beexaggerated or stylized for clarity.

The present disclosure may, however, be exemplified in many differentforms and should not be construed as being limited to the specificembodiments set forth herein. Rather these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the disclosure to those skilled in the art.

The term “an exemplary embodiment” used herein does not refer to thesame exemplary embodiment, and is provided to emphasize a particularfeature or characteristic different from that of another exemplaryembodiment. However, exemplary embodiments provided herein areconsidered to be able to be implemented by being combined in whole or inpart one with another. For example, one element described in aparticular exemplary embodiment, even if it is not described in anotherexemplary embodiment, may be understood as a description related toanother exemplary embodiment, unless an opposite or contradictorydescription is provided therein.

The meaning of a “connection” of a component to another component in thedescription includes an indirect connection through a third component aswell as a direct connection between two components. In addition,“electrically connected” means the concept including a physicalconnection and a physical disconnection. It can be understood that whenan element is referred to with “first” and “second”, the element is notlimited thereby. They may be used only for a purpose of distinguishingthe element from the other elements, and may not limit the sequence orimportance of the elements. In some cases, a first element may bereferred to as a second element without departing from the scope of theclaims set forth herein. Similarly, a second element may also bereferred to as a first element.

Herein, an upper portion, a lower portion, an upper side, a lower side,an upper surface, a lower surface, and the like, are decided in theaccompanying drawings. For example, a first connection member isdisposed on a level above a redistribution layer. However, the claimsare not limited thereto. In addition, a vertical direction refers to theabovementioned upward and downward directions, and a horizontaldirection refers to a direction perpendicular to the abovementionedupward and downward directions. In this case, a vertical cross sectionrefers to a case taken along a plane in the vertical direction, and anexample thereof may be a cross-sectional view illustrated in thedrawings. In addition, a horizontal cross section refers to a case takenalong a plane in the horizontal direction, and an example thereof may bea plan view illustrated in the drawings.

Terms used herein are used only in order to describe an exemplaryembodiment rather than limiting the present disclosure. In this case,singular forms include plural forms unless interpreted otherwise incontext.

Electronic Device

FIG. 1 is a schematic block diagram illustrating an example of anelectronic device system.

Referring to FIG. 1, an electronic device 1000 may accommodate amainboard 1010 therein. The mainboard 1010 may include chip relatedcomponents 1020, network related components 1030, other components 1040,and the like, physically or electrically connected thereto. Thesecomponents may be connected to others to be described below to formvarious signal lines 1090.

The chip related components 1020 may include a memory chip such as avolatile memory (for example, a dynamic random access memory (DRAM)), anon-volatile memory (for example, a read only memory (ROM)), a flashmemory, or the like; an application processor chip such as a centralprocessor (for example, a central processing unit (CPU)), a graphicsprocessor (for example, a graphics processing unit (GPU)), a digitalsignal processor, a cryptographic processor, a microprocessor, amicrocontroller, or the like; and a logic chip such as ananalog-to-digital (ADC) converter, an application-specific integratedcircuit (ASIC), or the like. However, the chip related components 1020are not limited thereto, but may also include other types of chiprelated components. In addition, the chip related components 1020 may becombined with each other.

The network related components 1030 may include protocols such aswireless fidelity (Wi-Fi) (Institute of Electrical And ElectronicsEngineers (IEEE) 802.11 family, or the like), worldwide interoperabilityfor microwave access (WiMAX) (IEEE 802.16 family, or the like), IEEE802.20, long term evolution (LTE), evolution data only (Ev-DO), highspeed packet access+ (HSPA+), high speed downlink packetaccess+(HSDPA+), high speed uplink packet access+ (HSUPA+), enhanceddata GSM environment (EDGE), global system for mobile communications(GSM), global positioning system (GPS), general packet radio service(GPRS), code division multiple access (CDMA), time division multipleaccess (TDMA), digital enhanced cordless telecommunications (DECT),Bluetooth, 3G, 4G, and 5G protocols, and any other wireless and wiredprotocols, designated after the abovementioned protocols. However, thenetwork related components 1030 are not limited thereto, but may alsoinclude a variety of other wireless or wired standards or protocols. Inaddition, the network related components 1030 may be combined with eachother, together with the chip related components 1020 described above.

Other components 1040 may include a high frequency inductor, a ferriteinductor, a power inductor, ferrite beads, a low temperature co-firedceramic (LTCC), an electromagnetic interference (EMI) filter, amultilayer ceramic capacitor (MLCC), or the like. However, othercomponents 1040 are not limited thereto, but may also include passivecomponents used for various other purposes, or the like. In addition,other components 1040 may be combined with each other, together with thechip related components 1020 or the network related components 1030described above.

Depending on a type of the electronic device 1000, the electronic device1000 may include other components that may or may not be physically orelectrically connected to the mainboard 1010. These other components mayinclude, for example, a camera module 1050, an antenna 1060, a displaydevice 1070, a battery 1080, an audio codec (not illustrated), a videocodec (not illustrated), a power amplifier (not illustrated), a compass(not illustrated), an accelerometer (not illustrated), a gyroscope (notillustrated), a speaker (not illustrated), a mass storage unit (forexample, a hard disk drive) (not illustrated), a compact disk (CD) drive(not illustrated), a digital versatile disk (DVD) drive (notillustrated), or the like. However, these other components are notlimited thereto, but may also include other components used for variouspurposes depending on a type of electronic device 1000, or the like.

The electronic device 1000 may be a smartphone, a personal digitalassistant (PDA), a digital video camera, a digital still camera, anetwork system, a computer, a monitor, a tablet PC, a laptop PC, anetbook PC, a television, a video game machine, a smartwatch, anautomotive component, or the like. However, the electronic device 1000is not limited thereto, but may be any other electronic deviceprocessing data.

FIG. 2 is a schematic perspective view illustrating an example of anelectronic device.

Referring to FIG. 2, an electronic device may be, for example, asmartphone 1100. A mainboard 1110 may be accommodated in a body 1101 ofthe smartphone 1100, and various electronic components 1120 such as asemiconductor package 1121 may be physically or electrically connectedto the mainboard 1110. In addition, other components that may or may notbe physically or electrically connected to the mainboard 1110, such asthe camera module 1130, may be accommodated in the body 1101. The cameramodule 1130 may include an image sensor package, and a fan-out sensorpackage according to the present disclosure may be used in thesmartphone. Meanwhile, the electronic device in which the fan-out sensorpackage according to the present disclosure is used is not limited tothe smartphone 1100. That is, the fan-out sensor package according tothe present disclosure may also be used in other electronic devices.

Semiconductor Package

A fan-out sensor package according to the present disclosure may bemanufactured using technology of a semiconductor package. Generally,numerous fine electrical circuits are integrated in a semiconductor.However, the semiconductor may not serve as a finished semiconductorproduct in itself, and may be damaged due to external physical orchemical impacts. Therefore, the semiconductor itself may not be used,but may be packaged and used in an electronic device, or the like, in apackaged state.

Here, semiconductor packaging is required due to the existence of adifference in a circuit width between the semiconductor and a mainboardof the electronic device in terms of electrical connections. In detail,a size of connection pads of the semiconductor and an interval betweenthe connection pads of the semiconductor are very fine, but a size ofcomponent mounting pads of the mainboard and an interval between thecomponent mounting pads of the mainboard are significantly larger thanthose of the semiconductor. Therefore, it may be difficult to directlymount the semiconductor on the mainboard, and packaging technology forbuffering a difference in a circuit width between the semiconductor andthe mainboard is required.

A semiconductor package manufactured by the packaging technology may beclassified as a fan-in semiconductor package or a fan-out semiconductorpackage depending on a structure and a purpose thereof.

The fan-in semiconductor package and the fan-out semiconductor packagewill hereinafter be described in more detail with reference to thedrawings.

Fan-In Semiconductor Package

FIGS. 3A and 3B are schematic cross-sectional views illustrating statesof a fan-in semiconductor package before and after being packaged.

FIG. 4 is schematic cross-sectional views illustrating a packagingprocess of a fan-in semiconductor package.

Referring to FIGS. 3 and 4, a semiconductor chip 2220 may be, forexample, an integrated circuit (IC) in a bare state, including a body2221 including silicon (Si), germanium (Ge), gallium arsenide (GaAs), orthe like, connection pads 2222 formed on one surface of the body 2221and including a conductive material such as aluminum (Al), or the like,and a passivation layer 2223 such as an oxide layer, a nitride layer, orthe like, formed on one surface of the body 2221 and covering at leastportions of the connection pads 2222. In this case, since the connectionpads 2222 may be significantly small, it may be difficult to mount theintegrated circuit (IC) on an intermediate level printed circuit board(PCB) as well as on the mainboard of the electronic device, or the like.

Therefore, a connection member 2240 may be formed depending on a size ofthe semiconductor chip 2220 on the semiconductor chip 2220 in order toredistribute the connection pads 2222. The connection member 2240 may beformed by forming an insulating layer 2241 on the semiconductor chip2220 using an insulating material such as a photoimagable dielectric(PID) resin, forming via holes 2243 h opening the connection pads 2222,and then forming wiring patterns 2242 and vias 2243. Then, a passivationlayer 2250 protecting the connection member 2240 may be formed, anopening 2251 may be formed, and an underbump metal layer 2260, or thelike, may be formed. That is, a fan-in semiconductor package 2200including, for example, the semiconductor chip 2220, the connectionmember 2240, the passivation layer 2250, and the underbump metal layer2260 may be manufactured through a series of processes.

As described above, the fan-in semiconductor package may have a packageform in which all of the connection pads, for example, input/output(I/O) terminals, of the semiconductor are disposed inside thesemiconductor, and may have excellent electrical characteristics and beproduced at a low cost. Therefore, many elements mounted in smartphoneshave been manufactured in a fan-in semiconductor package form. Indetail, many elements mounted in smartphones have been developed toimplement a rapid signal transfer while having a compact size.

However, since all I/O terminals need to be disposed inside thesemiconductor in the fan-in semiconductor package, the fan-insemiconductor package has significant spatial limitations. Therefore, itis difficult to apply this structure to a semiconductor having a largenumber of I/O terminals or a semiconductor having a compact size. Inaddition, due to the disadvantage described above, the fan-insemiconductor package may not be directly mounted and used on themainboard of the electronic device. The reason is that even in the casein which a size of the I/O terminals of the semiconductor and aninterval between the I/O terminals of the semiconductor are increased bya redistribution process, the size of the I/O terminals of thesemiconductor and the interval between the I/O terminals of thesemiconductor may not be sufficient to directly mount the fan-insemiconductor package on the mainboard of the electronic device.

FIG. 5 is a schematic cross-sectional view illustrating a case in whicha fan-in semiconductor package is mounted on a ball grid array (BGA)substrate and is ultimately mounted on a mainboard of an electronicdevice.

FIG. 6 is a schematic cross-sectional view illustrating a case in whicha fan-in semiconductor package is embedded in a BGA substrate and isultimately mounted on a mainboard of an electronic device.

Referring to FIGS. 5 and 6, in a fan-in semiconductor package 2200,connection pads 2222, that is, I/O terminals, of a semiconductor chip2220 may be redistributed through a BGA substrate 2301, and the fan-insemiconductor package 2200 may be ultimately mounted on a mainboard 2500of an electronic device in a state in which it is mounted on the BGAsubstrate 2301. In this case, solder balls 2270, and the like, may befixed by an underfill resin 2280, or the like, and an outer side of thesemiconductor chip 2220 may be covered with a molding material 2290, orthe like. Alternatively, a fan-in semiconductor package 2200 may beembedded in a separate BGA substrate 2302, connection pads 2222, thatis, I/O terminals, of the semiconductor chip 2220 may be redistributedby the BGA substrate 2302 in a state in which the fan-in semiconductorpackage 2200 is embedded in the BGA substrate 2302, and the fan-insemiconductor package 2200 may be ultimately mounted on a mainboard 2500of an electronic device.

As described above, it may be difficult to directly mount and use thefan-in semiconductor package on the mainboard of the electronic device.Therefore, the fan-in semiconductor package may be mounted on theseparate BGA substrate and be then mounted on the mainboard of theelectronic device through a packaging process or may be mounted and usedon the mainboard of the electronic device in a state in which it isembedded in the BGA substrate.

Fan-Out Semiconductor Package

FIG. 7 is a schematic cross-sectional view illustrating a fan-outsemiconductor package.

Referring to FIG. 7, in a fan-out semiconductor package 2100, forexample, an outer side of a semiconductor chip 2120 may be protected byan encapsulant 2130, and connection pads 2122 of the semiconductor chip2120 may be redistributed outwardly of the semiconductor chip 2120 by aconnection member 2140. In this case, a passivation layer 2150 mayfurther be formed on the connection member 2150, and an underbump metallayer 2160 may further be formed in openings of the passivation layer2150. Solder balls 2170 may further be formed on the underbump metallayer 2160. The semiconductor chip 2120 may be an integrated circuit(IC) including a body 2121, the connection pads 2122, a passivationlayer (not illustrated), and the like. The connection member 2140 mayinclude an insulating layer 2141, redistribution layers 2142 formed onthe insulating layer 2141, and vias 2143 electrically connecting theconnection pads 2122 and the redistribution layers 2142 to each other.

As described above, the fan-out semiconductor package may have a form inwhich I/O terminals of the semiconductor are redistributed and disposedoutwardly of the semiconductor through the connection member formed onthe semiconductor. As described above, in the fan-in semiconductorpackage, all I/O terminals of the semiconductor need to be disposedinside the semiconductor. Therefore, when a size of the semiconductor isdecreased, a size and a pitch of balls need to be decreased, such that astandardized ball layout may not be used in the fan-in semiconductorpackage. On the other hand, the fan-out semiconductor package has theform in which the I/O terminals of the semiconductor are redistributedand disposed outwardly of the semiconductor through the connectionmember formed on the semiconductor as described above. Therefore, evenin the case in which a size of the semiconductor is decreased, astandardized ball layout may be used in the fan-out semiconductorpackage as it is, such that the fan-out semiconductor package may bemounted on the mainboard of the electronic device without using aseparate BGA substrate, as described below.

FIG. 8 is a schematic cross-sectional view illustrating a case in whicha fan-out semiconductor package is mounted on a mainboard of anelectronic device.

Referring to FIG. 8, a fan-out semiconductor package 2100 may be mountedon a mainboard 2500 of an electronic device through solder balls 2170,or the like. That is, as described above, the fan-out semiconductorpackage 2100 includes the connection member 2140 formed on thesemiconductor chip 2120 and capable of redistributing the connectionpads 2122 to a fan-out region that is outside of a size of thesemiconductor chip 2120, such that the standardized ball layout may beused in the fan-out semiconductor package 2100 as it is. As a result,the fan-out semiconductor package 2100 may be mounted on the mainboard2500 of the electronic device without using a separate BGA substrate, orthe like.

As described above, since the fan-out semiconductor package may bemounted on the mainboard of the electronic device without using theseparate BGA substrate, the fan-out semiconductor package may beimplemented at a thickness lower than that of the fan-in semiconductorpackage using the BGA substrate. Therefore, the fan-out semiconductorpackage may be miniaturized and thinned. In addition, the fan-outelectronic component package has excellent thermal characteristics andelectrical characteristics, such that it is particularly appropriate fora mobile product. Therefore, the fan-out electronic component packagemay be implemented in a form more compact than that of a generalpackage-on-package (POP) type using a printed circuit board (PCB), andmay solve a problem due to the occurrence of a warpage phenomenon.

Meanwhile, the fan-out semiconductor package refers to packagetechnology for mounting the semiconductor on the mainboard of theelectronic device, or the like, as described above, and protecting thesemiconductor from external impacts, and is a concept different fromthat of a printed circuit board (PCB) such as a BGA substrate, or thelike, having a scale, a purpose, and the like, different from those ofthe fan-out semiconductor package, and having the fan-in semiconductorpackage embedded therein.

A fan-out sensor package according to the present disclosure may bemanufactured using the fan-out semiconductor package technologydescribed above. A fan-out sensor package according to the presentdisclosure will hereinafter be described with reference to the drawings.

FIG. 9 is a schematic cross-sectional view illustrating a fan-out sensorpackage according to a first exemplary embodiment in the presentdisclosure.

Referring to FIG. 9, a fan-out sensor package 100 according to a firstexemplary embodiment in the present disclosure may include a substrate110, an image sensor 120, an encapsulant 130, dam members 135, anoptical member 140, a passive element 150, and electrical connectionstructures 160 as an example.

Meanwhile, the fan-out sensor package 100 according to the firstexemplary embodiment may be used as a fingerprint recognizing moduleused in an electronic device as an example. However, the fan-out sensorpackage 100 is not limited thereto, but may be used for variouspurposes.

A through-hole 111 may be formed in, for example, a central portion ofthe substrate 110. As an example, the substrate 110 may include aninsulating layer 112 and a wiring layer 113 formed in the insulatinglayer 112. As an example, the wiring layer 113 may be a single layer.Meanwhile, the through-hole 111 may have a shape corresponding to thatof the optical member 140, and may have a size greater than that of theoptical member 140 so that the optical member 140 may be disposed in thethrough-hole 111.

In addition, portions of the wiring layer 113 may be exposed from theinsulating layer 112. That is, portions of the wiring layer 113 may beexposed from the insulating layer 112 in order to electrically connectthe substrate 110 and the image sensor 120.

The image sensor 120 may have an active surface 123 having a sensingregion 121 disposed below the through-hole 111 of the substrate 110 andconnection pads 122 disposed in the vicinity of the sensing region. Asan example, the image sensor 120 may be a complementary metal oxidesemiconductor (CMOS) image sensor (CIS), but is not limited thereto. Theimage sensor 120 may be formed on the basis of an active wafer. In thiscase, a base material of a body of the image sensor may be silicon (Si),germanium (Ge), gallium arsenide (GaAs), or the like. Various circuitsmay be formed on the body. The connection pads 122 may electricallyconnect the image sensor 120 to other components. A material of each ofthe connection pads 122 may be a conductive material such as aluminum(Al), or the like.

The term “vicinity” as used herein refers to an area immediatelyneighboring a particular defined feature or structure withoutoverlapping another defined feature or structure, the general size ofwhich is determined based on the design parameters of the structure. Forexample, the “vicinity” of a structure or feature may be an area havinga width of about 10%, about 15%, about 20%, or any number between thesepercentages, of the characteristic dimension of the structure or featureimmediately outside the area of the structure or feature. Thus, in someembodiments, the vicinity of a structure may be an area equal to,double, quadruple, eight times, nine times, sixteen times, or any othermultiplier between any two of these numbers, the area of that structure.Thus, if a connection pad has a size of 10 μm×10 μm, the vicinity may bean area surrounding the connection pad having a size of about 15 μm×15μm, 20 μm×20 μm, 25 μm×25 μm, 30 μm×30 μm or 40 μm×40 μm. On the otherhand, the “vicinity” of a sensor element having a size of 500 μm×500 μmmay be, for example, a 50 μm, 60 μm, 75 μm or 100 μm wide stripsurrounding the sensor element. It must be noted that the extent towhich the “vicinity” extends is determined by design parameters such as,for example, distance between defined structures or features. Forexample, if two neighboring connection pads, having a size of 10 μm×10μm each, are separated by an edge-to-edge distance 20 μm, the “vicinity”may be a strip of 2 μm width around all the edges of each of theconnection pads. On the other hand, for a sensor element having a sizeof 500 μm×500 μm, if the sensing region is a central portion of if thesensor element with a size of 400 μm×400 μm, the “vicinity” may be astrip having a width of about 50 μm, about 60 μm, about 75 μm or about100 μm surrounding the sensing region.

Meanwhile, the wiring layer 113 and the connection pads 122 may beelectrically connected to each other by connection members 124. As anexample, each of the connection members 124 may be formed of a bump.

The encapsulant 130 may encapsulate the substrate 110 and the imagesensor 120. As an example, the encapsulant 130 may serve to protect theimage sensor 120. An encapsulation form of the encapsulant 130 is notparticularly limited, but may be a form in which the encapsulant 130surrounds at least portions of the image sensor 120. For example, theencapsulant 130 may cover at least portions of the substrate 110 and theimage sensor 120.

Materials of the encapsulant 130 are not particularly limited. Forexample, an insulating material may be used as the materials of theencapsulant 130. In this case, the insulating material may be athermosetting resin such as an epoxy resin, a thermoplastic resin suchas polyimide, a resin having a reinforcing material such as an inorganicfiller impregnated in the thermosetting resin and the thermoplasticresin, for example, Ajinomoto Build-up Film (ABF), FR-4, BismaleimideTriazine (BT), a photoimagable dielectric (PID) resin, or the like. Inaddition, any known molding material such as an EMC, or the like, mayalso be used. Alternatively, a resin in which a thermosetting resin or athermoplastic resin is impregnated together with an inorganic filler ina core material such as a glass fiber (or a glass cloth or a glassfabric) may also be used as the insulating material.

The dam members 135 may be disposed in the vicinity of the sensingregion 121. Therefore, the dam members 135 may serve to prevent theencapsulant 130 from being introduced into the sensing region 121. As anexample, the dam members 135 may be formed of a material different fromthat of the encapsulant 130. That is, an insulating material differentfrom an insulating material used as a material of the encapsulant 130may be used as a material of the dam member 135. As an example, theinsulating material used as the material of the dam member 135 may be athermosetting resin such as an epoxy resin, a thermoplastic resin suchas a polyimide resin, a resin having a reinforcing material such as aninorganic filler impregnated in the thermosetting resin and thethermoplastic resin, for example, ABF, FR-4, BT, a PID resin, or thelike, similar to that of the encapsulant 130. In addition, any knownmolding material such as an EMC, or the like, may also be used.Alternatively, a resin in which a thermosetting resin or a thermoplasticresin is impregnated together with an inorganic filler in a corematerial such as a glass fiber (or a glass cloth or a glass fabric) mayalso be used as the insulating material.

The optical member 140 may be disposed on an upper surface of the imagesensor 120. As an example, the optical member 140 may be disposed on thesensing region 121 of the image sensor 120. In addition, side surfacesof the optical member 140 may be disposed to be spaced apart from innerwalls of the through-hole 111, and may be exposed to external air.

In addition, since the side surfaces of the optical member 140 aredisposed to be spaced apart from the inner walls of the through-hole111, an incident path of light may further be secured, and a lightrecognizing region by the image sensor 120 may thus be increased.

Meanwhile, since the optical member 140 is disposed to be spaced apartfrom the inner walls of the through-hole 111, stress applied to theoptical member 140 at the time of thermal impact may be decreased toimprove reliability of the optical member 140.

As an example, the optical member 140 may be formed of at least oneselected from the group consisting of sapphire, glass, reinforced glass,plastic, polycarbonates (PCs), and polyamides (PIs). In addition, theoptical member 140 may be, for example, a lens of which opticalcharacteristics such as a refractive index, a magnetic permeability, andthe like, are designed within a desired range. The optical member 140may be formed on the active surface of the image sensor 120 on a waferand be integrated with the image sensor 120.

The passive element 150 may be disposed in the vicinity of the imagesensor 120. Meanwhile, the passive element 150 may be installed on alower surface of the substrate 110, and may be encapsulated in theencapsulant 130 so that portions thereof are externally exposed. Thatis, the passive element 150 may be electrically connected to a mainboard(not illustrated), and may include connection portions 152 provided onone surface thereof in order to electrically connect the passive element150 and the mainboard to each other. In addition, the connectionportions 152 of the passive element 150 may be exposed externally fromthe encapsulant 130.

Each of the electrical connection structures 160 may be formed of aconductive material, for example, a solder, or the like. However, thisis only an example, and a material of each of the electrical connectionstructures 160 is not particularly limited thereto. Each of theelectrical connection structures 160 may be a land, a ball, a pin, abump, or the like. The electrical connection structures 160 may beformed as a multilayer or single layer structure. When the electricalconnection structures 160 are formed as a multilayer structure, theelectrical connection structures 160 may include a copper (Cu) pillarand a solder. When the electrical connection structures 160 are formedas a single layer structure, the electrical connection structures 160may include a tin-silver solder or copper (Cu). However, this is only anexample, and the electrical connection structures 160 are not limitedthereto. The number, an interval, a disposition form, and the like, ofelectrical connection structures 160 are not particularly limited, butmay be sufficiently modified depending on design particulars by thoseskilled in the art. For example, the electrical connection structures160 may be provided in an amount of several tens to several thousandsaccording to the number of connection pads 122 of the image sensor 120,or may be provided in an amount of several tens to several thousand ormore or several tens to several thousand or less. At least one of theelectrical connection structures 160 may be disposed in a fan-outregion. The fan-out region refers to a region except for the region inwhich the image sensor 120 is disposed. That is, the fan-out sensorpackage 100 according to the exemplary embodiment may be a fan-outpackage. The fan-out package may have excellent reliability as comparedto a fan-in package, may implement a plurality of input/output (I/O)terminals, and may facilitate a 3D interconnection. In addition, ascompared to a ball grid array (BGA) package, a land grid array (LGA)package, or the like, the fan-out package may be mounted on anelectronic device without a separate board. Thus, the fan-out packagemay be manufactured to have a small thickness, and may have pricecompetitiveness.

As described above, the side surfaces of the optical member 140 may bedisposed to be spaced apart from the inner walls of the through-hole111, and the incident path of the light may thus be further secured.Therefore, the light recognizing region by the image sensor 120 may beincreased.

Further, since the optical member 140 is disposed to be spaced apartfrom the inner walls of the through-hole 111, the stress applied to theoptical member 140 at the time of the thermal impact may be decreased toimprove the reliability of the optical member 140.

A method of manufacturing a fan-out sensor package according to a firstexemplary embodiment in the present disclosure will hereinafter bedescribed with reference to the drawings.

FIGS. 10 through 14 are views illustrating processes of a method ofmanufacturing a fan-out sensor package according to a first exemplaryembodiment in the present disclosure.

First, as illustrated in FIG. 10, the through-hole 111 may be formed inthe central portion of the substrate 110, and the dam members 135 may beformed on to be disposed on the lower surface of the substrate 110, thatis, in the vicinity of the through-hole 111. A material of the dammember 135 may be an insulating material. As an example, the insulatingmaterial used as the material of the dam member 135 may be athermosetting resin such as an epoxy resin, a thermoplastic resin suchas a polyimide resin, a resin having a reinforcing material such as aninorganic filler impregnated in the thermosetting resin and thethermoplastic resin, for example, ABF, FR-4, BT, a photoimagabledielectric (PID) resin, or the like, similar to that of the encapsulant130. In addition, any known molding material such as an EMC, or thelike, may also be used. Alternatively, a resin in which a the mosettingresin or a thermoplastic resin is impregnated together with an inorganicfiller in a core material such as a glass fiber (or a glass cloth or aglass fabric) may also be used as the insulating material.

Meanwhile, the optical member 140 may be formed on the sensing region121 of the image sensor 120, and the connection members 124 forelectrical connection between the connection pads 122 of the imagesensor 120 and the substrate 110 may be formed on the connection pads122 of the image sensor 120.

As an example, the optical member 140 may be formed of at least oneselected from the group consisting of sapphire, glass, reinforced glass,plastic, polycarbonates (PCs), and polyamides (PIs).

Then, as illustrated in FIG. 11, the substrate 110 and the image sensor120 may be connected to each other. In this case, the optical member 140may be disposed in the through-hole 111 of the substrate 110. Inaddition, the side surfaces of the optical member 140 may be disposed tobe spaced apart from the inner walls of the through-hole 111, and may beexposed to the external air.

In addition, the connection pads 122 of the image sensor 120 may beelectrically connected to the wiring layer 113 of the substrate 110through the connection members 124.

Then, as illustrated in FIG. 12, the passive element 150 may beinstalled on the lower surface of the substrate 110, and the electricalconnection structures 160 may be formed on the lower surface of thesubstrate 110. The passive element 150 and the electrical connectionstructures 160 may be disposed in the vicinity of the image sensor 120.

In addition, the passive element 150 and the electrical connectionstructures 160 may also be connected to the wiring layer 113 of thesubstrate 110.

Then, as illustrated in FIG. 13, the image sensor 120, the passiveelement 150, and the electrical connection structures 160 may beencapsulated in the encapsulant 130. As an example, the encapsulant 130may be formed of a material different from that of the dam member 135. Amaterial of the encapsulant 130 may be an insulating material. As anexample, the insulating material may be a thermosetting resin such as anepoxy resin, a thermoplastic resin such as a polyimide resin, a resinhaving a reinforcing material such as an inorganic filler impregnated inthe thermosetting resin and the thermoplastic resin, for example, ABF,FR-4, BT, a PID resin, or the like. In addition, any known moldingmaterial such as an EMC, or the like, may also be used. Alternatively, aresin in which a thermosetting resin or a thermoplastic resin isimpregnated together with an inorganic filler in a core material such asa glass fiber (or a glass cloth or a glass fabric) may also be used asthe insulating material.

Then, as illustrated in FIG. 14, portions of the passive element 150,that is, the connection portions 152, and portions of the electricalconnection structures 160 may be exposed by removing portions of theencapsulant 130.

As described above, a manufacturing yield of the fan-out sensor packagemay be improved by omitting a complicated process such as a wire bondingprocess and directly installing the image sensor 120 on the substrate110.

Further, since the side surfaces of the optical member 140 may bedisposed to be exposed to the external air, the incident path of thelight may further be secured. Therefore, the light recognizing region bythe image sensor 120 may be increased.

Further, since the optical member 140 is disposed to be spaced apartfrom the inner walls of the through-hole 111, the stress applied to theoptical member 140 at the time of the thermal impact may be decreased toimprove the reliability of the optical member 140.

Fan-out sensor packages according to other exemplary embodiments in thepresent disclosure will hereinafter be described with reference to thedrawings.

FIG. 15 is a schematic cross-sectional view illustrating a fan-outsensor package according to a second exemplary embodiment in the presentdisclosure.

Referring to FIG. 15, a fan-out sensor package 200 according to a secondexemplary embodiment in the present disclosure may include a substrate210, an image sensor 120, an encapsulant 230, and an optical member 140as an example.

Meanwhile, since the image sensor 120 and the optical member 140correspond to the components described above, a detailed descriptiontherefor is omitted.

The substrate 210 may include a first substrate 212 in which a firstthrough-hole 211 is formed and a second substrate 214 in which a secondthrough-hole 213 is formed. The image sensor 120 may be disposed in thesecond through-hole 213.

As an example, the first through-hole 211 may be formed in a centralportion of the first substrate 212. As an example, the first substrate212 may include a first insulating layer 212 a and a first wiring layer212 b formed in the first insulating layer 212 a. As an example, thefirst wiring layer 212 b may be a single layer.

Meanwhile, the first through-hole 211 may have a shape corresponding tothat of the optical member 140, and may have a size greater than that ofthe optical member 140 so that the optical member 140 may be disposed inthe first through-hole 211.

The second substrate 214 may be disposed below the first substrate 212.In addition, the second through-hole 213 may be disposed below the firstthrough-hole 211, and may have a shape corresponding to that of theimage sensor 120. Meanwhile, connection pads 214 a may be provided on anupper surface and a lower surface of the second substrate 214, and vias214 b for connecting the connection pads 214 a to each other may beprovided in the second substrate 214.

In addition, the first and second substrates 212 and 214 may beelectrically connected to each other by connection members 216, and asealing member 218 may be disposed between the first and secondsubstrates 212 and 214.

The encapsulant 230 may encapsulate the image sensor 120 and the secondsubstrate 214. That is, the encapsulant 230 may be filled in the secondthrough-hole 213 of the second substrate 214. As an example, materialsof the encapsulant 230 are not particularly limited. For example, aninsulating material may be used as the materials of the encapsulant 230.In this case, the insulating material may be a thermosetting resin suchas an epoxy resin, a thermoplastic resin such as polyimide, a resinhaving a reinforcing material such as an inorganic filler impregnated inthe thermosetting resin and the thermoplastic resin, for example, ABF,FR-4, BT, a PID resin, or the like. In addition, any known moldingmaterial such as an EMC, or the like, may also be used. Alternatively, aresin in which a thermosetting resin or a thermoplastic resin isimpregnated together with an inorganic filler in a core material such asa glass fiber (or a glass cloth or a glass fabric) may also be used asthe insulating material.

Meanwhile, the connection pads 214 a of the second substrate 214 may beexposed externally from the encapsulant 230 and be connected to amainboard (not illustrated) through solders, or the like.

As described above, the substrate 210 may include the first substrate212 and the second substrate 214 to improve a wiring density.

In addition, side surfaces of the optical member 140 may be disposed tobe spaced apart from the first through-hole 211, and an incident path oflight may thus be further secured. Therefore, a light recognizing regionby the image sensor 120 may be increased.

Further, since the side surfaces of the optical member 140 are disposedto be spaced apart from the first through-hole 211, stress applied tothe optical member 140 at the time of thermal impact may be decreased toimprove reliability of the optical member 140.

FIG. 16 is a schematic cross-sectional view illustrating a fan-outsensor package according to a third exemplary embodiment in the presentdisclosure.

Referring to FIG. 16, a fan-out sensor package 300 according to a thirdexemplary embodiment in the present disclosure may include a substrate110, an image sensor 120, an encapsulant 130, an optical member 140, andelectrical connection structures 360 as an example.

Meanwhile, since the substrate 110, the image sensor 120, theencapsulant 130, and the optical member 140 correspond to the componentsdescribed above, a detailed description therefor is omitted.

The electrical connection structures 360 may be formed on a lowersurface of the substrate 110, and may have a thickness greater than thatof the image sensor 120. Further, as an example, a lower end portion ofeach of the electrical connection structures 360 may protrude from theencapsulant 130. As an example, each of the electrical connectionstructures 360 may be formed of a conductive material, for example, asolder, or the like. However, this is only an example, and a material ofeach of the electrical connection structures 360 is not particularlylimited thereto. Each of the electrical connection structures 360 may bea land, a ball, or the like. The electrical connection structures 360may be formed as a multilayer or single layer structure. When theelectrical connection structures 360 are formed as a multilayerstructure, the electrical connection structures 360 may include a copper(Cu) pillar and a solder. When the electrical connection structures 360are formed as a single layer structure, the electrical connectionstructures 360 may include a tin-silver solder or copper (Cu). However,this is only an example, and the electrical connection structures 360are not limited thereto. The number, an interval, a disposition form,and the like, of electrical connection structures 360 are notparticularly limited, but may be sufficiently modified depending ondesign particulars by those skilled in the art. In addition, theelectrical connection structures 360 may be connected to a mainboard(not illustrated), such that the substrate 110 and the main board may beelectrically connected to each other.

As described above, the electrical connection structures 360 mayprotrude from the encapsulant 130, and a separate process of removingthe encapsulant 130 in order to expose the electrical connectionstructures 360 may thus be omitted.

Therefore, a manufacturing yield of the fan-out sensor package may beimproved.

Further, side surfaces of the optical member 140 may be disposed to bespaced apart from inner walls of the through-hole 111, and an incidentpath of a light may thus be further secured. Therefore, a lightrecognizing region by the image sensor 120 may be increased.

Further, since the optical member 140 is disposed to be spaced apartfrom the inner walls of the through-hole 111, stress applied to theoptical member 140 at the time of thermal impact may be decreased toimprove reliability of the optical member 140.

FIG. 17 is a schematic cross-sectional view illustrating a fan-outsensor package according to a fourth exemplary embodiment in the presentdisclosure.

Referring to FIG. 17, a fan-out sensor package 400 according to a fourthexemplary embodiment in the present disclosure may include a substrate110, an image sensor 120, an encapsulant 130, an optical member 140, andmetal bars 460 as an example.

Meanwhile, since the substrate 110, the image sensor 120, theencapsulant 130, and the optical member 140 correspond to the componentsdescribed above, a detailed description therefor is omitted.

The metal bars 460 may be disposed in the vicinity of the image sensor120, and may be disposed so that one end thereof is exposed from theencapsulant 130. As an example, the other end of the metal bar 460 maybe connected to a wiring layer 113 of the substrate 110, and one endthereof may be exposed externally from the encapsulant 130 as describedabove.

The metal bars 460 may be components for electrically connecting amainboard (not illustrated) and the substrate 110 to each other, andwhen the metal bars 460 are formed, electrical conductivity may beimproved.

FIG. 18 is a schematic cross-sectional view illustrating a fan-outsensor package according to a fifth exemplary embodiment in the presentdisclosure.

Referring to FIG. 18, a fan-out sensor package 500 according to a fifthexemplary embodiment in the present disclosure may include a substrate110, an image sensor 120, an encapsulant 530, an optical member 140, andelectrical connection structures 160 as an example.

Meanwhile, since the substrate 110, the image sensor 120, the opticalmember 140, and the electrical connection structures 160 correspond tothe components described above, a detailed description therefor isomitted.

The encapsulant 530 may encapsulate the image sensor 120 and thesubstrate 110, and may have a thickness at which a lower surface of theimage sensor 120 is externally exposed.

In addition, materials of the encapsulant 530 are not particularlylimited. For example, an insulating material may be used as thematerials of the encapsulant 530. In this case, the insulating materialmay be a thermosetting resin such as an epoxy resin, a thermoplasticresin such as polyimide, a resin having a reinforcing material such asan inorganic filler impregnated in the thermosetting resin and thethermoplastic resin, for example, ABF, FR-4, BT, a PID resin, or thelike. In addition, any known molding material such as an EMC, or thelike, may also be used. Alternatively, a resin in which a thermosettingresin or a thermoplastic resin is impregnated together with an inorganicfiller in a core material such as a glass fiber (or a glass cloth or aglass fabric) may also be used as the insulating material.

As described above, when the thickness of the encapsulant 530 isdecreased so that the lower surface of the image sensor 120 isexternally exposed, an entire thickness of the fan-out sensor package500 may be decreased, such that thinness of the fan-out sensor packagemay be implemented.

FIG. 19 is a schematic cross-sectional view illustrating a fan-outsensor package according to a sixth exemplary embodiment in the presentdisclosure.

Referring to FIG. 19, a fan-out sensor package 600 according to a sixthexemplary embodiment in the present disclosure may include a substrate610, an image sensor 120, an encapsulant 130, an optical member 140, andelectrical connection structures 160 as an example.

Meanwhile, since the image sensor 120, the encapsulant 130, the opticalmember 140, and the electrical connection structures 160 correspond tothe components described above, a detailed description therefor isomitted.

A through-hole 611 may be formed in a central portion of the substrate610. As an example, the substrate 610 may include an insulating layer612 and wiring layers 613 formed in the insulating layer 612. As anexample, the wiring layers 613 may be a plurality of layers. Meanwhile,the through-hole 611 may have a shape corresponding to that of theoptical member 140, and may have a size greater than that of the opticalmember 140 so that the optical member 140 may be disposed in thethrough-hole 611.

As described above, the wiring layers 613 may be formed as the pluralityof layers, and a degree of freedom of a design of the substrate 610 maythus be improved.

FIG. 20 is a schematic cross-sectional view illustrating a fan-outsensor package according to a seventh exemplary embodiment in thepresent disclosure.

Referring to FIG. 20, a fan-out sensor package 700 according to aseventh exemplary embodiment in the present disclosure may include asubstrate 110, an image sensor 120, an encapsulant 730, an opticalmember 140, and electrical connection structures 160 as an example.

Meanwhile, since the substrate 110, the image sensor 120, the opticalmember 140, and the electrical connection structures 160 correspond tothe components described above, a detailed description therefor isomitted.

The encapsulant 730 may encapsulate the image sensor 120 and thesubstrate 110. In addition, the encapsulant 730 may also be filled inspaces formed by side surfaces of the optical member 140 and inner wallsof the through-hole 111.

Meanwhile, materials of the encapsulant 730 are not particularlylimited. For example, an insulating material may be used as thematerials of the encapsulant 730. In this case, the insulating materialmay be a thermosetting resin such as an epoxy resin, a thermoplasticresin such as polyimide, a resin having a reinforcing material such asan inorganic filler impregnated in the thermosetting resin and thethermoplastic resin, for example, ABF, FR-4, BT, a PID resin, or thelike. In addition, any known molding material such as an EMC, or thelike, may also be used. Alternatively, a resin in which a thermosettingresin or a thermoplastic resin is impregnated together with an inorganicfiller in a core material such as a glass fiber (or a glass cloth or aglass fabric) may also be used as the insulating material.

Therefore, rigidity of the fan-out sensor package 700 may be increased.

FIG. 21 is a schematic cross-sectional view illustrating a fan-outsensor package according to an eighth exemplary embodiment in thepresent disclosure.

Referring to FIG. 21, a fan-out sensor package 800 according to aneighth exemplary embodiment in the present disclosure may include asubstrate 110, an image sensor 120, an encapsulant 130, an opticalmember 140, a passive element 150, electrical connection structures 160,and a transparent material 870 as an example.

Meanwhile, since the substrate 110, the image sensor 120, theencapsulant 130, the optical member 140, the passive element 150, andthe electrical connection structures 160 correspond to the componentsdescribed above, a detailed description therefor is omitted.

The transparent material 870 may be filled in spaces between sidesurfaces of the optical member 140 and inner walls of the through-hole111. Therefore, introduction of foreign materials into the image sensor120 may be prevented, and an incident path of light may be secured.

As set forth above, according to an exemplary embodiment in the presentdisclosure, a sensing area may be increased by increasing a path oflight incident to an image sensor, and reliability of an optical membermay be improved by decreasing stress applied to the optical member atthe time of thermal impact.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. A fan-out sensor package comprising: a substratein which a through-hole is formed and portions of a wiring layer areexposed from an insulating layer; an image sensor having an activesurface having a sensing region disposed below the through-hole of thesubstrate and connection pads disposed in the vicinity of the sensingregion; an optical member disposed directly on the active surface of theimage sensor; a dam member disposed in the vicinity of the sensingregion; and an encapsulant encapsulating the substrate and the imagesensor, wherein the wiring layer and the connection pads areelectrically connected to each other by connection members.
 2. Thefan-out sensor package of claim 1, wherein side surfaces of the opticalmember are disposed to be spaced apart from inner walls of the substratethat form the through-hole.
 3. The fan-out sensor package of claim 1,wherein side surfaces of the optical member are exposed to external air.4. The fan-out sensor package of claim 1, further comprising a passiveelement disposed in the vicinity of the image sensor and encapsulated inthe encapsulant, portions thereof being externally exposed.
 5. Thefan-out sensor package of claim 4, further comprising an electricalconnection structure encapsulated in the encapsulant, portions thereofbeing externally exposed.
 6. The fan-out sensor package of claim 1,wherein the substrate includes a first substrate in which a firstthrough-hole is formed and a second substrate in which a secondthrough-hole is formed, the image sensor being disposed in the secondthrough-hole.
 7. The fan-out sensor package of claim 6, wherein thefirst substrate and the second substrate are electrically connected toeach other by a connection member formed of a conductive material, and asealing member is disposed between the first and second substrates. 8.The fan-out sensor package of claim 6, wherein connection pads of thesecond substrate are disposed to be exposed externally from theencapsulant.
 9. The fan-out sensor package of claim 1, furthercomprising an electrical connection structure disposed in the vicinityof the image sensor and protruding from the encapsulant.
 10. The fan-outsensor package of claim 1, further comprising a metal bar disposed inthe vicinity of the image sensor and disposed so that one end thereof isexposed from the encapsulant.
 11. The fan-out sensor package of claim 1,wherein the encapsulant encapsulates the image sensor, and a lowersurface of the image sensor is externally exposed.
 12. The fan-outsensor package of claim 1, wherein a plurality of wiring layers areformed in the substrate.
 13. A fan-out sensor package comprising: asubstrate in which a through-hole is formed and portions of a wiringlayer are exposed from an insulating layer; an image sensor having anactive surface having a sensing region disposed in the through-hole ofthe substrate and connection pads disposed in the vicinity of thesensing region; an optical member disposed directly on the activesurface of the image sensor; and an encapsulant encapsulating thesubstrate and the image sensor, wherein the wiring layer and theconnection pads are electrically connected to each other by connectionmembers.
 14. The fan-out sensor package of claim 13, wherein theencapsulant is filled in spaces between side surfaces of the opticalmember and inner walls of the substrate that form the through-hole. 15.The fan-out sensor package of claim 13, further comprising a transparentmaterial filled in spaces between side surfaces of the optical memberand inner walls of the substrate that form the through-hole.
 16. Afan-out sensor package, comprising: an image sensor having an activesurface having a sensing region and comprising connection pads disposedon an active area of the active surface outside of the sensing region;an optical member disposed directly on the active surface and coveringthe sensing region and not covering the connection pads; a firstsubstrate comprising an insulating layer, a wiring layer exposed from afirst surface of the insulating layer and a through-hole in theinsulating layer, the first substrate being disposed on the image sensorsuch that the optical member is disposed in the through-hole and thefirst surface faces the active surface; an encapsulant encapsulating atleast a portion of each of the first substrate and the image sensor; andconnection members electrically connecting the connection pads of theimage sensor to the wiring layer.
 17. The fan-out sensor package ofclaim 16, further comprising a second substrate having a secondthrough-hole being disposed below the first substrate such that theimage sensor is disposed in the second through-hole.
 18. The fan-outsensor package of claim 16, further comprising a dam member disposed onthe first substrate and surrounding the through-hole such that theencapsulant is prevented from contacting the sensing region.
 19. Thefan-out sensor package of claim 16, further comprising a passivecomponent disposed adjacent to the image sensor such that a portion ofthe passive component is exposed through the encapsulant.